logo
Home > Products >
Multi Wire Saw Machine
>
60kw Main Power Multi Wire Saw Machine with Water Cooling System and 0.55mm Wire Thickness for Precision Cutting

60kw Main Power Multi Wire Saw Machine with Water Cooling System and 0.55mm Wire Thickness for Precision Cutting

Product Details:
Brand Name: OEM
Detail Information
Brand Name:
OEM
Eletric System:
Siemens
Cutting Method:
Multi-wire Sawing
Productname:
Multi Wire Saw Machine
Precision:
±0.01 Mm
Cuttingthicknessrange:
0.1 Mm To 10 Mm
Leading Wheel Material:
Aviation Aluminum Alloy
Wire Thickness:
0.55mm
Machinetype:
Wire Saw Cutting Machine
Highlight:

High Light

Highlight:

60kw Main Power Multi Wire Saw Machine

,

Water Cooling System Wire Cutting Machine

,

0.55mm Wire Thickness Silicon Wafer Cutting Machine

Trading Information
Minimum Order Quantity:
1
Payment Terms:
TT
Product Description
50Hz Multiple Wire Saw Machine with 60kW Main Power
This advanced wire cutting machine is engineered for precision slicing of silicon wafers, delivering exceptional performance and reliability for semiconductor and electronics manufacturing. The state-of-the-art technology ensures accurate cutting while minimizing material waste and maximizing production yield.
Key Features
  • Efficient water cooling system maintains optimal operating temperatures
  • Robust 380V, 50Hz, 3-phase power supply for continuous operation
  • Wire diameter range: 0.18mm to 0.25mm for versatile cutting applications
  • Multi-wire sawing technology for simultaneous cutting operations
  • Stone lifting mechanism for enhanced stability and precision
Technical Specifications
Power Supply 380V, 50Hz, 3 Phase
Leading Wheel Material Aviation Aluminum Alloy
Cooling System Water Cooling System
Cutting Method Multi-wire Sawing
Usage Cutting Silicon Wafers
Lifting Method Stone Lifting Type
Electric System Siemens
Main Power 60kW
Wire Thickness 0.55mm
Wire Diameter 0.18mm to 0.25mm
Industrial Applications
This multiple wire saw machine is essential for semiconductor manufacturing plants requiring high throughput and precision. It's extensively used in:
  • Silicon wafer production for solar panels and electronic devices
  • Research and development facilities for advanced material slicing
  • Industries requiring precise cutting of brittle and hard materials
  • Mass production environments and specialized cutting workshops
Customization Options
We offer comprehensive customization services to meet your specific requirements:
  • Minimum order quantity: 1 unit
  • Flexible payment terms (TT)
  • Cutting thickness range: 0.1mm to 10mm
  • Tailored configurations for unique operational needs
Support & Services
Our comprehensive support ensures optimal performance and longevity:
  • Installation guidance and operational training
  • Troubleshooting and maintenance support
  • Regular software updates and hardware upgrades
  • Genuine spare parts and consumables
  • Customized service contracts and on-site support
Quality Assurance
Backed by a comprehensive one-year warranty, ensuring prompt professional support and minimal downtime for your operations.