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Precision ±0.01 mm Multi Wire Saw Machine with 0.55mm Wire Thickness and Siemens Electric System for Silicon Wafer Cutting

Product Details:

Brand Name:	OEM

Detail Information

Brand Name:

OEM

Cutting Method:

Multi-wire Sawing

Usage:

Cutting Silicon Wafers

Wire Thickness:

0.55mm

Eletric System:

Siemens

Productname:

Multi Wire Saw Machine

Cuttingthicknessrange:

0.1 Mm To 10 Mm

Machinetype:

Wire Saw Cutting Machine

Powersupply:

380V, 50Hz, 3 Phase

Highlight:

High Light

Highlight:

±0.01 mm Precision Multi Wire Saw Machine

0.55mm Wire Thickness Wire Cutting Machine

Siemens Electric System Multi-wire Sawing Machine

Trading Information

Minimum Order Quantity:

Payment Terms:

Product Description

Precision Multi Wire Saw Machine

Advanced wire cutting machine designed for precise and efficient cutting of silicon wafers using innovative multi-wire sawing technology.

Key Features

±0.01 mm cutting precision for minimal material loss
0.55mm wire thickness optimized for durability and fine cutting
Multi-wire sawing method for simultaneous wafer cutting
Siemens electric system with 60kw main power
Stone lifting method for stable operation

Technical Specifications

Parameter	Specification
Machine Type	Wire Saw Cutting Machine
Product Name	Multi Wire Saw Machine
Usage	Cutting Silicon Wafers
Wire Diameter	0.18 mm to 0.25 mm
Wire Thickness	0.55 mm
Precision	±0.01 mm
Electric System	Siemens
Main Power	60kw
Cutting Method	Multi-wire Sawing
Lifting Method	Stone Lifting Type

Industrial Applications

This precision wire cutting machine is essential for semiconductor fabrication, photovoltaic cell production, and electronic component manufacturing where high-accuracy silicon wafer cutting is critical.

Primary Use Cases

Semiconductor wafer fabrication plants
Photovoltaic solar cell production
Advanced material research laboratories
Electronic component manufacturing facilities

Customization Options

Our OEM multi wire saw machines offer tailored solutions with flexible configuration options to meet specific production requirements.

Customization Features

Minimum order quantity: 1 unit
Power compatibility: 380V, 50Hz, 3 Phase
Wire diameter range: 0.18 mm to 0.25 mm
Flexible payment terms via TT

Support & Services

Comprehensive One-Year Warranty

Includes professional technical support, maintenance services, and comprehensive after-sales assistance.

Technical Support Services

Installation guidance and operational training
Troubleshooting and maintenance support
Remote diagnostics and software updates
On-site maintenance and spare parts supply
Performance optimization consultations

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Precision ±0.01 mm Multi Wire Saw Machine with 0.55mm Wire Thickness and Siemens Electric System for Silicon Wafer Cutting

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