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Siemens Electric System Wire Cutting Machine Incorporating Aviation Aluminum Alloy Leading Wheel Material Designed for Operation
Siemens Electric System Wire Cutting Machine Incorporating Aviation Aluminum Alloy Leading Wheel Material Designed for Operation
  • Siemens Electric System Wire Cutting Machine Incorporating Aviation Aluminum Alloy Leading Wheel Material Designed for Operation

Siemens Electric System Wire Cutting Machine Incorporating Aviation Aluminum Alloy Leading Wheel Material Designed for Operation

Product Details:
Place of Origin: China
Brand Name: OEM
Detail Information
Place of Origin:
China
Brand Name:
OEM
Wire Diameter:
0.1mm
Cutting Method:
Multi-wire Sawing
Power Consumption:
20kW
Dimensions:
5000*3000*2000mm
Lifting Method:
Stone Lifting Type
Warranty:
One Year
Model:
MW-1000
Leading Wheel Material:
Aviation Aluminum Alloy
Highlight:

High Light

Highlight:

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aviation aluminum alloy wire saw

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multi wire saw machine

Trading Information
Minimum Order Quantity:
1
Payment Terms:
TT
Product Description
Siemens Electric System Wire Cutting Machine
MW-1000 Multiple Wire Saw Machine
The MW-1000 is a state-of-the-art wire cutting machine designed for precision cutting of silicon wafers. With a robust 300kW power capacity and optimized 20kW operational consumption, it delivers unparalleled performance in semiconductor manufacturing while minimizing energy costs and material waste.
Key Features
  • Precision cutting with multiple wires for increased productivity
  • Advanced Siemens electric system for reliable operation
  • Aviation aluminum alloy leading wheel for durability
  • Automated tension control and intelligent cooling system
  • Ergonomic design with safety interlocks for operator protection
  • Modular components for easy maintenance
Technical Specifications
Parameter Value
Usage Cutting Silicon Wafers
Leading Wheel Material Aviation Aluminum Alloy
Wire Diameter 0.1mm
Processing Thickness 5-30mm
Cutting Method Multi-wire Sawing
Electric System Siemens
Wire Thickness 0.55mm
Dimensions 5000×3000×2000mm
Power Consumption 20kW
Warranty One Year
Applications
The MW-1000 is ideal for semiconductor fabrication plants, solar panel manufacturing facilities, and research laboratories. Its multi-wire sawing technology with water cooling system ensures high-quality cuts for:
  • Silicon wafer production
  • Photovoltaic cell manufacturing
  • Precision material research
  • Custom wafer slicing applications
Customization Options
Our OEM Multi Wire Saw Machine offers flexible customization to meet specific production requirements:
  • Minimum order quantity: 1 unit
  • Flexible payment terms (TT accepted)
  • Custom power configurations available
  • Specialized cutting parameters
Support & Services
We provide comprehensive support to ensure optimal machine performance:
  • Installation guidance and operational training
  • Detailed user manuals and service documentation
  • Regular software updates and hardware upgrades
  • Onsite maintenance and repair services
  • One-year warranty coverage
Packaging & Shipping
Each MW-1000 is securely packaged in protective materials and sturdy wooden crates. We offer multiple shipping options:
  • Sea freight for cost-effective delivery
  • Air freight for urgent requirements
  • Express courier services available
  • Complete documentation for customs clearance

Tags:

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