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Multi Wire Saw Machine with 0.18 Mm To 0.25 Mm Wire Diameter Featuring Water Cooling System and Siemens Electric System

Product Details:

Brand Name:	OEM

Detail Information

Brand Name:

OEM

Eletric System:

Siemens

Cuttingthicknessrange:

0.1 Mm To 10 Mm

Wire Thickness:

0.55mm

Coolingsystem:

Water Cooling System

Powersupply:

380V, 50Hz, 3 Phase

Wirediameter:

0.18 Mm To 0.25 Mm

Productname:

Multi Wire Saw Machine

Cutting Method:

Multi-wire Sawing

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0.18 Mm To 0.25 Mm Wire Diameter Multi Wire Saw Machine

Water Cooling System Wire Cutting Machine

Siemens Electric System Multiple Wire Saw Machine

Trading Information

Minimum Order Quantity:

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Product Description

Multi Wire Saw Machine for Silicon Wafer Cutting

The Multi Wire Saw Machine is an advanced wire cutting system engineered for high-precision silicon wafer processing in semiconductor manufacturing. This multiple wire cutting technology delivers exceptional accuracy and throughput while minimizing material waste.

Key Features

Multiple wire simultaneous cutting for enhanced productivity
Ultra-thin 0.55mm wire thickness for minimal material loss
Exceptional cutting precision of ±0.01 mm
Robust construction with advanced wire tensioning system
Water cooling system for optimal thermal management
User-friendly interface with precise control systems
Advanced safety features and automated controls
Comprehensive one-year warranty coverage

Technical Specifications

Parameter	Specification
Wire Thickness	0.55mm
Electric System	Siemens
Wire Diameter Range	0.18 mm to 0.25 mm
Cutting Method	Multi-wire Sawing
Machine Type	Wire Saw Cutting Machine
Cooling System	Water Cooling System
Power Supply	380V, 50Hz, 3 Phase
Main Power	60kw
Warranty	One Year
Primary Usage	Cutting Silicon Wafers

Applications

This precision wire cutting machine is engineered for demanding applications across multiple industries:

Semiconductor wafer fabrication
Solar panel and photovoltaic cell production
Integrated circuits and microelectronics
Glass cutting and advanced ceramics processing
Research and development laboratories

The machine handles cutting thickness from 0.1 mm to 10 mm, making it suitable for both delicate materials and industrial-scale production.

Customization Options

We offer comprehensive customization services for our OEM Multiple Wire Saw Machines to meet specific production requirements:

Wire diameter configuration from 0.18 mm to 0.25 mm
Adaptable for various material types and thicknesses
Minimum order quantity: 1 unit
Flexible payment terms including TT options

Support & Services

Technical Support

Comprehensive assistance including installation guidance, operation support, troubleshooting, and software updates with detailed manuals and video tutorials.

Professional Services

Installation and commissioning services
Routine maintenance including wire replacement and tension adjustment
Lubrication checks and performance optimization

Training Programs

Operator and maintenance personnel training covering machine operation, safety protocols, and maintenance procedures.

Spare Parts & Warranty

Genuine spare parts and accessories available. Standard warranty covers manufacturing defects and faulty components.

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Multi Wire Saw Machine with 0.18 Mm To 0.25 Mm Wire Diameter Featuring Water Cooling System and Siemens Electric System

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