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0.55mm Wire Thickness Multi Wire Saw Machine with Water Cooling System and Siemens Electric System for Silicon Wafer Cutting

Product Details:

Brand Name:	OEM

Detail Information

Brand Name:

OEM

Precision:

±0.01 Mm

Productname:

Multi Wire Saw Machine

Usage:

Cutting Silicon Wafers

Cuttingthicknessrange:

0.1 Mm To 10 Mm

Eletric System:

Siemens

Cutting Method:

Multi-wire Sawing

Main Power:

60kw

Leading Wheel Material:

Aviation Aluminum Alloy

Highlight:

High Light

Highlight:

0.55mm Wire Thickness Multi Wire Saw Machine

Water Cooling System Wire Cutting Machine

Siemens Electric System Multiple Wire Saw Machine

Trading Information

Minimum Order Quantity:

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Product Description

Multi Wire Saw Machine for Silicon Wafer Cutting

The Multi Wire Saw Machine is an advanced precision cutting system specifically engineered for the semiconductor industry. Designed to slice silicon wafers with exceptional accuracy and minimal material waste, this state-of-the-art equipment utilizes multiple wire technology to deliver unparalleled performance and reliability in wafer production.

Key Precision Feature

Maintains cutting accuracy of ±0.01 mm, ensuring silicon wafers meet stringent quality standards for high-performance electronic components.

Technical Specifications

Power Supply	380V, 50Hz, 3 Phase
Cutting Thickness Range	0.1 mm to 10 mm
Electric System	Siemens
Wire Diameter	0.18 mm to 0.25 mm
Lifting Method	Stone Lifting Type
Cooling System	Water Cooling System
Wire Thickness	0.55 mm
Machine Type	Wire Saw Cutting Machine
Cutting Method	Multi-wire Sawing

Industrial Applications

This high-performance wire cutting machine serves multiple precision manufacturing sectors with its advanced multi-wire sawing technology and robust 60kw power system.

Semiconductor Manufacturing: Precision slicing of silicon wafers for electronic components
Solar Panel Production: Uniform cutting of solar cells to enhance efficiency
Electronics Industry: Accurate processing of hard and brittle materials
Aerospace Components: High-precision cutting of specialized materials

The multi-wire configuration enables simultaneous cutting of multiple wafers, significantly increasing throughput while maintaining exceptional surface quality and minimizing material waste.

Customization Options

We offer flexible customization services for the Multi Wire Saw Machine to meet your specific production requirements:

Minimum order quantity: 1 unit
Payment terms: TT (Telegraphic Transfer)
Standard warranty: 1 year
Main power: 60kw
Wire diameter range: 0.18 mm to 0.25 mm

Technical Support & Services

Comprehensive Technical Support

Our experienced technicians provide installation, setup, and troubleshooting assistance with detailed user manuals and online resources.

Maintenance Programs

Scheduled maintenance services including wire replacement, lubrication, calibration, and component inspection to prevent breakdowns and extend equipment life.

Operator Training

Complete training sessions covering machine operation, safety protocols, routine maintenance, and troubleshooting techniques.

Parts & Upgrades

Genuine spare parts and technology upgrades available to enhance machine capabilities and performance.

Warranty Coverage

Standard warranty for manufacturing defects with optional extended service agreements including priority support and maintenance visits.

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Multi Wire Saw Machine with Aviation Aluminum Alloy Leading Wheel Siemens Electric System and Water Cooling for Precision Cutting

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0.55mm Wire Thickness Multi Wire Saw Machine with Water Cooling System and Siemens Electric System for Silicon Wafer Cutting

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Multi Wire Saw Machine with 0.55mm Wire Thickness Stone Lifting Type and Water Cooling System for Precision Cutting

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