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Stone Lifting Type Multi Wire Saw Machine with 60kw Main Power for Precision Cutting Thickness Range 0.1 Mm To 10 Mm

Product Details:

Brand Name:	OEM

Detail Information

Brand Name:

OEM

Wirediameter:

0.18 Mm To 0.25 Mm

Powersupply:

380V, 50Hz, 3 Phase

Lifting Method:

Stone Lifting Type

Productname:

Multi Wire Saw Machine

Machinetype:

Wire Saw Cutting Machine

Usage:

Cutting Silicon Wafers

Cuttingthicknessrange:

0.1 Mm To 10 Mm

Cutting Method:

Multi-wire Sawing

Highlight:

High Light

Highlight:

Stone Lifting Type Multi Wire Saw Machine

Cutting Thickness Range 0.1 Mm To 10 Mm Wire Cutting Machine

Main Power 60kw Wire Saw Cutting Machine

Trading Information

Minimum Order Quantity:

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Product Description

Stone Lifting Type Multi Wire Saw Machine

Advanced wire cutting machine designed for precision cutting applications in the semiconductor industry, featuring multi-wire sawing technology for superior efficiency and accuracy when cutting silicon wafers.

Advanced Cutting Technology

This multiple wire saw machine revolutionizes wafer slicing with higher throughput and superior surface quality compared to traditional single-wire saw machines. The multi-wire sawing technique employs numerous thin wires simultaneously to slice through silicon ingots, significantly reducing cutting time and enhancing wafer thickness uniformity.

Key Technical Specifications

Parameter	Specification
Cutting Method	Multi-wire Sawing
Cooling System	Water Cooling System
Precision	±0.01 mm
Warranty	One Year
Wire Thickness	0.55 mm
Lifting Method	Stone Lifting Type
Wire Diameter	0.18 mm to 0.25 mm
Cutting Thickness Range	0.1 mm to 10 mm
Usage	Cutting Silicon Wafers

Integrated Water Cooling System

The advanced water cooling system effectively dissipates heat generated during cutting operations, maintaining optimal temperatures to prevent thermal damage to wafers and extend wire lifespan. This cooling mechanism ensures production of smooth, crack-free wafer surfaces.

Industrial Applications

This versatile wire cutting machine serves multiple industries with precision cutting requirements:

Semiconductor manufacturing for slicing thin wafers with minimal material loss
Photovoltaic panel production for cutting solar cells
Advanced material processing and research laboratories
Sample preparation in material testing centers

Premium Components & Features

Siemens electric system for reliable performance and precise control
Aviation aluminum alloy leading wheel for durability and stability
User-friendly controls and automation features
Adjustable parameters for wire speed, tension, and cooling flow rate
Minimal kerf loss and high material utilization

Customization Options

Our OEM multi wire saw machine offers flexible customization services with a minimum order quantity of just 1 unit. Tailored solutions available to meet specific production requirements with convenient TT payment terms.

Comprehensive Support Services

Dedicated technical support team provides installation guidance, routine maintenance, troubleshooting assistance, and regular software updates. Includes detailed user manuals, operator training, and spare parts availability to ensure optimal performance throughout the machine lifecycle.

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Stone Lifting Type Multi Wire Saw Machine with 60kw Main Power for Precision Cutting Thickness Range 0.1 Mm To 10 Mm

High Light

Highlight:

Stone Lifting Type Multi Wire Saw Machine

Cutting Thickness Range 0.1 Mm To 10 Mm Wire Cutting Machine

Main Power 60kw Wire Saw Cutting Machine

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