Product Overview
The Multi Wire Saw Machine is an advanced wire cutting system engineered for precise, efficient, and high-quality cutting performance across various materials. Incorporating cutting-edge technology, this machine excels in handling complex sawing tasks with exceptional accuracy and speed. Ideal for stone processing, semiconductor manufacturing, and other industrial applications, it delivers unmatched reliability and operational ease.
Precision Cutting with Fine Wire
Utilizing a 0.55mm wire thickness, this machine achieves extremely fine and precise cuts. The slender wire diameter minimizes material wastage while maintaining high cutting efficiency, balancing strength and flexibility for diverse materials.
Multi-Wire Sawing Technology
The multi-wire sawing method employs multiple wires simultaneously to cut materials, significantly boosting productivity by processing multiple slices in one operation. This approach reduces processing time, enhances cut uniformity, and minimizes kerf loss for material conservation.
Stone Lifting Mechanism
Designed with a stone lifting type system, this machine handles heavy stone blocks and slabs with precision and control. The mechanism ensures smooth material movement during cutting, reducing damage risk and improving workflow efficiency.
Durable Construction & Warranty
Built from high-quality components for rigorous industrial use, this machine includes a comprehensive one-year warranty covering manufacturing defects, ensuring reliable long-term performance.
Technical Specifications
| Main Power |
60kw |
| Electric System |
Siemens |
| Wire Diameter |
0.18 mm to 0.25 mm |
| Cooling System |
Water Cooling System |
| Usage |
Cutting Silicon Wafers |
| Precision |
±0.01 mm |
| Lifting Method |
Stone Lifting Type |
| Power Supply |
380V, 50Hz, 3 Phase |
| Leading Wheel Material |
Aviation Aluminum Alloy |
| Machine Type |
Wire Saw Cutting Machine |
Industrial Applications
This precision wire cutting machine serves multiple industrial sectors with its ±0.01 mm accuracy and 0.18-0.25 mm wire diameter range. The 60kw main power ensures consistent performance in demanding production environments.
- Semiconductor Manufacturing: Delicate slicing of silicon wafers with high throughput
- Photovoltaic Industry: Cutting solar cells to optimize material usage and quality
- Gemstone & Glass Processing: Clean cuts in fragile materials with minimal waste
- Research Laboratories: Precise slicing of experimental materials with minimal deviation
With a minimum order quantity of 1 unit and TT payment terms, this machine is accessible to businesses of all sizes, from small operations to large-scale manufacturers.
Customization Options
Our OEM multi wire saw machine offers comprehensive customization services to meet specific operational requirements. We provide flexible solutions with the following options:
- Custom wire thickness up to 0.55mm
- Wire diameter range from 0.18 mm to 0.25 mm
- Siemens electric system for reliable performance
- Multi-wire sawing cutting method for efficiency
- ±0.01 mm precision for consistent results
- TT payment terms for secure transactions
- Minimum order quantity: 1 unit
Support & Services
Technical Support
Our expert team provides comprehensive assistance including installation, operation, and troubleshooting. We offer detailed user manuals, instructional videos, remote support, regular software updates, and maintenance guidelines to optimize machine performance.
Professional Services
- On-site installation and commissioning
- Preventive maintenance packages to minimize downtime
- Operator and maintenance personnel training sessions
- Original spare parts and consumables availability
- Technology upgrade options for improved efficiency
We are committed to delivering exceptional customer service and ensuring complete satisfaction with your multi wire saw machine investment.
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