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Multi Wire Saw Machine with 0.55mm Wire Thickness Stone Lifting Type and Siemens Electric System for Precise Cutting

Multi Wire Saw Machine with 0.55mm Wire Thickness Stone Lifting Type and Siemens Electric System for Precise Cutting

Product Details:
Brand Name: OEM
Detail Information
Brand Name:
OEM
Wire Thickness:
0.55mm
Machinetype:
Wire Saw Cutting Machine
Lifting Method:
Stone Lifting Type
Cuttingthicknessrange:
0.1 Mm To 10 Mm
Cutting Method:
Multi-wire Sawing
Eletric System:
Siemens
Wirediameter:
0.18 Mm To 0.25 Mm
Warranty:
One Year
Highlight:

High Light

Highlight:

0.55mm Wire Thickness Multi Wire Saw Machine

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Stone Lifting Type Wire Saw Cutting Machine

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Siemens Electric System Wire Cutting Machine

Trading Information
Minimum Order Quantity:
1
Payment Terms:
TT
Product Description
Multiple Wire Saw Machine Overview
The Multiple Wire Saw Machine is an advanced wire cutting system engineered for high-performance stone processing applications. Utilizing cutting-edge multi-wire sawing technology, this machine enables simultaneous precision cutting of stone blocks into uniform slabs with exceptional accuracy and efficiency.
Key Performance Features
  • Wire Diameter Range: 0.18 mm to 0.25 mm for durable, fine-cutting capability
  • Power System: 380V, 50Hz, 3-phase power supply for stable, reliable operation
  • Lifting Mechanism: Stone lifting type for secure handling and precise positioning
  • Cutting Method: Multi-wire sawing technology for simultaneous slab production
  • Warranty Coverage: Comprehensive one-year warranty for operational peace of mind
Technical Specifications
Product Name Multi Wire Saw Machine
Warranty One Year
Leading Wheel Material Aviation Aluminum Alloy
Power Supply 380V, 50Hz, 3 Phase
Cutting Method Multi-wire Sawing
Cutting Thickness Range 0.1 mm to 10 mm
Lifting Method Stone Lifting Type
Usage Cutting Silicon Wafers
Electric System Siemens
Wire Diameter 0.18 mm to 0.25 mm
Industrial Applications
This precision wire cutting machine serves multiple industries requiring meticulous material processing with high-quality finishes:
  • Semiconductor Industry: High-accuracy silicon wafer slicing with minimal material loss
  • Electronics Manufacturing: Cutting thin, fragile components without damage
  • Stone Processing: Granite, marble, and quartz slab production
  • Specialized Materials: Gemstones, glass, and ceramics processing
  • Research & Education: Laboratory analysis and experimental material sectioning
Water Cooling System: Integrated cooling maintains optimal wire and workpiece temperatures, preventing overheating while extending wire lifespan and ensuring cut quality.
Customization Options
Our OEM Multiple Wire Saw Machine offers flexible customization services tailored to specific operational requirements:
  • Minimum Order: 1 unit
  • Wire Thickness: 0.55mm configuration available
  • Leading Wheel: Aviation aluminum alloy construction
  • Payment Terms: TT (Telegraphic Transfer)
  • Power Configuration: 380V, 50Hz, 3 Phase operation
Technical Support & Services
Comprehensive support package ensures optimal machine performance and longevity:
  • Installation & Training: Comprehensive setup guidance and operator training
  • Maintenance Services: Routine maintenance to maximize efficiency and lifespan
  • Technical Assistance: Troubleshooting support and engineering expertise
  • Software Updates: Firmware and software maintenance
  • Parts Availability: Ready access to spare parts and consumables
  • Custom Solutions: Tailored upgrades for specific operational requirements