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Multi Wire Saw Machine with Aviation Aluminum Alloy Leading Wheel Siemens Electric System and Water Cooling for Precision Cutting

Product Details:

Brand Name:	OEM

Detail Information

Brand Name:

OEM

Eletric System:

Siemens

Productname:

Multi Wire Saw Machine

Powersupply:

380V, 50Hz, 3 Phase

Wirediameter:

0.18 Mm To 0.25 Mm

Machinetype:

Wire Saw Cutting Machine

Usage:

Cutting Silicon Wafers

Warranty:

One Year

Leading Wheel Material:

Aviation Aluminum Alloy

Highlight:

High Light

Highlight:

Aviation Aluminum Alloy Leading Wheel Multi Wire Saw Machine

Siemens Electric System Wire Cutting Machine

Water Cooling System Wire Saw Cutting Machine

Trading Information

Minimum Order Quantity:

Payment Terms:

Product Description

Aviation Aluminum Alloy Leading Wheel Material Wire Cutting Machine

This advanced 3-phase power supply wire cutting machine is engineered for high-precision cutting of silicon wafers in semiconductor manufacturing. Utilizing multi-wire sawing technology, it delivers exceptional accuracy, efficiency, and minimal material waste.

Advanced Cutting Technology

The multi-wire sawing method employs multiple fine wires simultaneously to slice through silicon ingots with remarkable speed and precision. This approach significantly increases cutting throughput compared to traditional single-wire saws while reducing mechanical stress on wafers to minimize micro-cracks and defects.

Key Performance Features

Water Cooling System: Maintains optimal operating temperatures to prevent overheating and ensure consistent cutting quality
Siemens Electrical System: Provides precise control, efficient energy management, and user-friendly operation
Aviation Aluminum Alloy Leading Wheel: Ensures durability and smooth operation under continuous usage
380V, 50Hz, 3-Phase Power: Delivers stable energy for demanding industrial environments

Technical Specifications

Power Supply	380V, 50Hz, 3 Phase
Cooling System	Water Cooling System
Warranty	One Year
Cutting Method	Multi-wire Sawing
Wire Diameter	0.18 mm to 0.25 mm
Primary Application	Cutting Silicon Wafers
Lifting Method	Stone Lifting Type
Electrical System	Siemens
Machine Type	Wire Saw Cutting Machine
Leading Wheel Material	Aviation Aluminum Alloy
Main Power	60kw

Industrial Applications

This versatile wire cutting machine serves multiple industries requiring precision cutting of hard and brittle materials:

Semiconductor industry for silicon wafer slicing
Solar industry for photovoltaic panel cutting
Electronics sector for delicate component processing
Jewelry manufacturing and precision engineering
Research laboratories and educational institutions

Customization Options

We offer comprehensive OEM customization services with a minimum order quantity of 1 unit. Customizable parameters include wire thickness (0.55mm standard) with precision of ±0.01 mm. Payment terms via TT for convenient transactions.

Support & Services

Comprehensive Technical Support

Expert installation guidance and operational training
Scheduled maintenance services and calibration
High-quality spare parts and accessories
Upgrade options and customization services
One-year warranty with optional service agreements

Our commitment ensures your Multiple Wire Saw Machine operates at peak efficiency, minimizing downtime and maximizing productivity in your manufacturing operations.

Tags:

0.55mm Wire Thickness Multi Wire Saw Machine with Water Cooling System and Siemens Electric System for Silicon Wafer Cutting

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Multi Wire Saw Machine with 0.18 Mm To 0.25 Mm Wire Diameter Featuring Water Cooling System and Siemens Electric System

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Multi Wire Saw Machine with Aviation Aluminum Alloy Leading Wheel Siemens Electric System and Water Cooling for Precision Cutting

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Multi Wire Saw Machine with 0.18 Mm To 0.25 Mm Wire Diameter Featuring Water Cooling System and Siemens Electric System