Automated Multi Wire Saw Granite Cutting Machine Marble Gangsaw Machine 300kw

Multi Granite Wire Saw Cutting Machine Marble Gangsaw Machine Multi Wire Saw Block Cutting Equipment

Product Introduction

Product Parameters

1. Origin and Development of Diamond Wire Saw Technology

Diamond wire saw technology originated from the multi-wire cutting machines used in the photovoltaic industry for silicon wafer processing. Its core process involves electroplating a layer of diamond particles onto a thin metal wire, utilizing the grinding action of the diamonds to achieve material cutting. Since its adoption in the photovoltaic silicon wafer processing industry in 2015, the technology has undergone two critical developmental phases:  
 

• 2015–2017: Replaced traditional mortar wire cutting processes, with cumulative installations exceeding 10,000 units in the photovoltaic sector.  
• 2017–2020: Expanded into the rare-earth magnetic materials industry, achieving installations surpassing 10,000 units.  

After nearly a decade of industrial application (as of 2024), diamond wire saw technology has matured and established a complete industrial chain. Beyond dominating the photovoltaic and magnetic materials sectors, it has also replaced traditional processes in hard and brittle material processing industries such as sapphire, optical glass, and graphite.  

2. China’s Unique Market Position and Technological Expansion

 
China’s photovoltaic and magnetic materials industries hold over 95% of the global market share, creating a uniquely favorable environment for the development of diamond wire saw technology. As the technology matured, supporting multi-wire cutting equipment, diamond wires, and auxiliary industrial chains achieved scaled development, driving continuous cost reductions.

3. Challenges in Technological Breakthroughs for Stone Processing  

In 2018, Pinhe began exploring the application of diamond wire saws in the stone industry, encountering the following technical challenges:

•  Dimensional Disparity: Stone processing sizes (based on 800 × 210 × 210 mm) are over 10 times larger than materials like photovoltaic silicon wafers.  
• Process Complexity: Requires addressing the material heterogeneity and dimensional variability of stone.  
• Cost Optimization: Involves systemic improvements in cutting efficiency, consumable costs, and equipment stability.  

Currently, while diamond wire saws are fully mature in the photovoltaic sector, their application in stone processing remains in the industrialization breakthrough phase, necessitating solutions for ultra-large-scale cutting process adaptation.